JPH0360191B2 - - Google Patents
Info
- Publication number
- JPH0360191B2 JPH0360191B2 JP58219087A JP21908783A JPH0360191B2 JP H0360191 B2 JPH0360191 B2 JP H0360191B2 JP 58219087 A JP58219087 A JP 58219087A JP 21908783 A JP21908783 A JP 21908783A JP H0360191 B2 JPH0360191 B2 JP H0360191B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- metal plate
- printed wiring
- wiring board
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21908783A JPS60111489A (ja) | 1983-11-21 | 1983-11-21 | 電子部品塔載用基板およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21908783A JPS60111489A (ja) | 1983-11-21 | 1983-11-21 | 電子部品塔載用基板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60111489A JPS60111489A (ja) | 1985-06-17 |
| JPH0360191B2 true JPH0360191B2 (en]) | 1991-09-12 |
Family
ID=16730053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21908783A Granted JPS60111489A (ja) | 1983-11-21 | 1983-11-21 | 電子部品塔載用基板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60111489A (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6134990A (ja) * | 1984-07-25 | 1986-02-19 | イビデン株式会社 | 電子部品搭載用基板およびその製造方法 |
| JP2612455B2 (ja) * | 1987-09-30 | 1997-05-21 | イビデン株式会社 | 半導体素子搭載用基板 |
| JP2010258260A (ja) * | 2009-04-27 | 2010-11-11 | Nec Corp | 放熱プリント基板 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59132641U (ja) * | 1983-02-25 | 1984-09-05 | 日本電気株式会社 | 半導体装置用基板 |
-
1983
- 1983-11-21 JP JP21908783A patent/JPS60111489A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60111489A (ja) | 1985-06-17 |
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